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  • 「芯動全球·智啟新程」金晟達電路在2025世界半導體展邀您共探電路創(chuàng)新邊界!


    2025年,半導體行業(yè)迎來技術變革新紀元!金晟達電路作為高端PCB智造專家,將攜核心技術與前沿方案,重磅亮相世界半導體展覽會(展位號:T9),與全球伙伴共繪“芯”藍圖!
    In 2025, the semiconductor industry will usher in a new era of technological transformation! As an expert in high-end PCB manufacturing, JSDPCB will showcase its core technologies and cutting-edge solutions at the World Semiconductor Exhibition (Booth No. : T9), and join hands with global partners to draw a blueprint for the "core"!


    展會聚焦亮點:
    Exhibition highlights:
    ?? 「硬核技術」突破:
    「Hardcore Technology」Breakthrough:
    高密度互聯(lián)(HDI)電路板,賦能AI服務器、自動駕駛、衛(wèi)星通信等尖端領域;
    超薄柔性電路板,解鎖可穿戴設備、折疊屏終端的無限可能;
    高速高頻材料工藝,助力5G/6G、數(shù)據(jù)中心實現(xiàn)“零延遲”傳輸。
    High-density interconnect (HDI) circuit boards empower cutting-edge fields such as AI servers, autonomous driving, and satellite communications;
    Ultra-thin flexible circuit boards unlock unlimited possibilities for wearable devices and foldable screen terminals.
    High-speed and high-frequency material technology helps 5G/6G and data centers achieve "zero-latency" transmission.


    ?? 「綠色智造」升級:
    「Green Intelligent Manufacturing」 Upgrade:
    低碳環(huán)保材料+全流程數(shù)字化管控,踐行ESG理念,引領行業(yè)可持續(xù)發(fā)展;
    智能工廠實時演示,見證從設計到量產(chǎn)的“極速響應”。
    Low-carbon and environmentally friendly materials + full-process digital control, practicing the ESG concept, leading the sustainable development of the industry;
    Real-time demonstration of the smart factory, witnessing the "ultra-fast response" from design to mass production.


    ?? 「定制化」全鏈服務:
    「Customized」 full-chain service
    1對1專家團隊,提供從需求分析、方案設計到批量交付的“一站式”支持;
    快速打樣服務,縮短研發(fā)周期,搶占市場先機。
    A one-on-one expert team provides "one-stop" support from requirement analysis, solution design to batch delivery.
    Rapid prototyping service shortens the R&D cycle and seizes market opportunities first.


    ?? 「未來對話」論壇:
    「Future Dialogue」 Forum:
    技術大咖現(xiàn)場分享《半導體與PCB協(xié)同創(chuàng)新趨勢》,共探產(chǎn)業(yè)鏈協(xié)同機遇。
    Technical experts shared on the spot "Trends of Collaborative Innovation in Semiconductors and PCBS", jointly exploring opportunities for industrial chain collaboration.


    展會信息:
    Exhibition Information:
    ? 時間:2025年6月20日-22日  Time: June 20th - 22nd, 2025
    ?? 地點:中國南京國際博覽中心5號館  Location: Hall 5, Nanjing International Expo Center, China
    ?? 金晟達展位:T9   JSDPCB booth: T9